Cooled by Corintis Keikku — Don't miss a beat Reach out and let's chat! Fill the form First and Last name E-mail address Company Role Message Send Please tick the ReCaptcha checkbox. LinkedIn Leave your details to receive the PDF case study Fill the form First and Last name E-mail address Company Role Send Please tick the ReCaptcha checkbox. LinkedIn Submitting your interest Therminator system Fill the form First and Last name E-mail address Company Send Therminator system Please tick the ReCaptcha checkbox. LinkedIn Submitting your interest Order TTVs Fill the form First and Last name E-mail address Company Send Order TTVs Please tick the ReCaptcha checkbox. LinkedIn TherminatorContact us Cooled by Corintis We’re building 10× better chip-cooling to unlock the next 100× better compute Microsoft announces breakthrough in collaboration with Corintis Corintis was awarded “#1 Swiss Startup of 2025 1 / 2 Featured in Cooling is the ultimate bottleneck for silicon chips that drive AI and cloud computing. The next 100× increase in compute performance will require 10× better cooling and current data center cooling solutions can´t keep up with the rising heat. Liquid cooling is the new standard, and we set the standard for designing, building, testing and mass-producing leading-edge liquid cooling for high-power chips in data centers. High-end chips are heating up Cooling datacenter globally water consumed annualy 100B liters Cooling datacenter globally consumes more electricity than New York & London combined GPU temperature90.5ºc GPU memory clock2,000Mhz GPU core voltage1.025V GPU core load98% GPU memory clock2,000Mhz GPU thermal limit100ºc Heatflux400w/cm2 GPU power1893W 40c+inlet temperature Introducing CorintisChip cooling redefined Unlock the next leap in compute performance with Corintis: Targeted microfluidic cooling, tailored for performance and efficiency, to reliably run the most powerful chips at the lowest possible temperatures. Designed with micro-scale precision for large-scale production, to future-proof your data center & HPC applications. Up to 10× better chip-cooling Be one step ahead of the heat by using our streamlined platform to design, build, test, and mass-produce the world’s best microfluidic cold plates and co-packaged cooling solutions. Achieve higher TDP with less flow rate and pressure drop in a shorter cycle time. Just like nature, we harness evolution to tailor cooling to the chip, bringing the right amount of liquid to the right location and achieving maximum cooling performance. Now Available Therminator™ Accelerate thermal testing and validation data center cooling View Currently in closed Beta Glacierware Our world-class design platform Offices in Switzerland, United States & Germany Multiple locations, one common goal Whitepaper Ask for the Corintis Whitepaper Careers Check our Open Positions Lausanne Rue des Jordils 38 - 1025 Saint-Sulpice - Switzerland Germany Regus Munich Leuchtenbergring- Dingolfinger Straße 15, 81673 München United States 301 116th Avenue SE - Suite 404 - Bellevue, WA 98004 2026 © Corintis LinkedIn Made by Büro